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Signal and Power Integrity - Simplified
Signal and Power Integrity - Simplified - Edition #3
Hardcover - English

The #1 Practical Guide to Signal Integrity Design--with Revised Content and New Questions and Problems

This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching several thousand engineers and graduate students, world-renowned expert Eric Bogatin systematically presents the root causes of all six families of signal integrity, power integrity, and electromagnetic compatibility problems. Bogatin reviews essential principles needed to understand these problems, and shows how to use best design practices and techniques to prevent or address them early in the design cycle. To help test and reinforce your understanding, this new edition adds questions and problems throughout. Bogatin also presents more examples using free tools, plus new content on high-speed serial links, reflecting input from 130+ of his graduate students.

- A fully up-to-date introduction to signal integrity and physical design
- New questions and problems designed for both students and professional engineers
- How design and technology selection can make or break power distribution network performance
- Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance
- Practical techniques for analyzing resistance, capacitance, inductance, and impedance
- Using QUCS to predict waveforms as voltage sources are affected by interconnect impedances
- Identifying reflections and crosstalk with free animation tools
- Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement
- Understanding how interconnect physical design impacts signal integrity
- Managing differential pairs and losses
- Harnessing the full power of S-parameters in high-speed serial link applications
- Designing high-speed serial links associated with differential pairs and lossy lines--including new coverage of eye diagrams
- Ensuring power integrity throughout the entire power distribution path
- Realistic design guidelines for improving signal integrity, and much more

For professionals and students at all levels of experience, this book emphasizes intuitive understanding, practical tools, and engineering discipline, rather than theoretical derivation or mathematical rigor. It has earned a well-deserved reputation as the #1 resource for getting signal integrity designs right--first time, every time.

RM 977.60
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ADDITIONAL INFO

Edition Number
3
ISBN
013451341X
EAN
9780134513416
Publisher
Publication Date
02 Jan 2018
Pages
992
Weight (kg)
1.79
Dimensions (cm)
23.4 x 18.0 x 5.6
About Author
ERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.
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